NXP Semiconductors To Establish A Joint Venture To Build And Operate A 300mm Fab for $7.8 billion
June 5 (Reuters) -Nxp Semiconductors NXPI.O:
VIS AND NXP TO ESTABLISH A JOINT VENTURE TO BUILD AND OPERATE A 300MM FAB
TOTAL COST OF INITIAL BUILD OUT IS ANTICIPATED TO BE $7.8 BILLION
JOINT VENTURE WILL CREATE APPROXIMATELY 1,500 JOBS IN SINGAPORE
VIS TO INJECT $2.4 BILLION REPRESENTING A 60 PERCENT EQUITY POSITION IN JV; NXP WILL INJECT $1.6 BILLION FOR 40% EQUITY POSITION
VIS AND NXP HAVE AGREED TO CONTRIBUTE AN ADDITIONAL $1.9 BILLION WHICH WILL BE UTILIZED TO SUPPORT LONG-TERM CAPACITY INFRASTRUCTURE
FAB WILL BE OPERATED BY VIS
REMAINING FUNDING INCLUDING LOANS WILL BE PROVIDED BY THIRD PARTIES TO JOINT VENTURE
JOINT VENTURE WILL BEGIN CONSTRUCTION OF INITIAL PHASE OF WAFER FAB IN SECOND HALF OF 2024
PENDING RECEIPT OF ALL REQUIRED REGULATORY APPROVALS, WITH INITIAL PRODUCTION AVAILABLE TO CUSTOMERS DURING 2027
Source text for Eikon: ID:nGNX8NJ4RC
Further company coverage: NXPI.O
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