Company

Investment

Intel INTC.O

In 2022, Intel said it would invest up to $100 billion to build potentially the world's largest chip-making complex in Ohio. The company also broke ground on two new factories in Arizona in September 2021.

Taiwan Semiconductor Manufacturing Company Ltd (TSMC)2330.TW

TSMC said in December 2022 it plans to invest $40 billion in its chip plant in Arizona. The plant is scheduled to be operational in 2024. In April this year, the company agreed to expand its planned investment by $25 billion to $65 billion and add a third Arizona fab by 2030.

Wolfspeed Inc WOLF.N

In September 2022, Wolfspeed said it would build a new multi-billion dollar silicon carbide wafer factory in Chatham County, North Carolina to make chips that power things such as electric vehicles. Wafers are raw materials used for making chips.

Micron Technology MU.O

In October 2022, Micron said it planned to invest up to $100 billion over the next 20-plus years to build a computer chip factory complex in upstate New York. The company also announced a $15 billion factory in Boise, Idaho in September.

GlobalFoundries GFS.O

GlobalFoundries in July 2021 said it will build a second factory near its in Malta, New York, headquarters, and spend $1 billion to boost output to address the global chip shortage. The company will also expand existing operations there and in Burlington, Vermont, according to a preliminary agreement with the U.S. Commerce Department in February this year.

Texas Instruments TXN.O

The company has several wafer fab projects underway, including in Richardson and Sherman in Texas and in Lehi, Utah. It expects production at the Utah fab, which it bought from Micron for $900 million, to commence in 2026

Samsung Electronics Co Ltd 005930.KS

In 2021, Samsung said it would invest in a $17 billion chip plant in Taylor, Texas to make advanced chips for mobile, 5G, high-performance computing and artificial intelligence. The chip plant would cost Samsung over $25 billion, up more than $8 billion from initial forecasts, Reuters exclusively reported last year.

SkyWater Technology SKYT.O

It announced plans in July 2022 to invest $1.8 billion for a chip research and production facility in Indiana, in partnership with the state and Purdue University.

SK Hynix 000660.KS

SK Hynix said in April it would invest around $3.87 billion to build an advanced packaging plant, and research and development facility for AI products in Indiana.

Company

Investment

Infineon IFXGn.DE

Infineon won approval to begin work on a 5 billion euro ($5.42 billion)semiconductor plant in the German city of Dresden, it said on February 2023. Production is due to start in 2026.

STMicroelectronics STM.BN

The Franco-Italian company said in October 2022 it plans to build a 730 million euro silicon carbide wafer plant in Italy. Building is due to be complete in 2026.

It also announced plans in July 2022 to build a semiconductor factory in France in partnership with GlobalFoundries GFS.O.

The European Commission approved Italian state aid for the company in May to build a 5 billion euro ($5.43 billion) chip plant.

Taiwan Semiconductor Manufacturing Company Ltd (TSMC)2330.TW

In May this year, TSMC said it planned to start construction of its first European facility in Dresden, Germany, in the fourth quarter of 2024, with production expected to begin in 2027.

Wolfspeed Inc WOLF.N

Wolfspeed has delayed plans to build a $3 billion plant in Germany, highlighting the EU's struggle to increase semiconductor production and reduce its reliance on Asian chips.

Silicon Box

Singapore-based semiconductor firm Silicon Box plans to pick the town of Novara in the industrialised northwest Piedmont region as the location for its new multibillion-euro chip factory in Italy, two people close to the matter told Reuters in June.

It will invest 3.2 billion euros ($3.4 billion) to produce so-called "chiplets" in Italy.

Intel

The European Commission has given Poland a green light to support an Intel chip assembly and testing plant with more than 7.4 billion zlotys ($1.91 billion) in state aid, the government said.

Onsemi ON.O

Onsemi will invest up to $2 billion to boost its semiconductor output in the Czech Republic, the chipmaker said in June.

Pending approval of state aid, Onsemi will expand its operations in the eastern town of Roznov pod Radhostem to house the full production chain for silicon carbide semiconductors including final chip modules used in the automotive and renewables sectors.

Company

Investment

Taiwan Semiconductor Manufacturing Company Ltd (TSMC)2330.TW

TSMC said in February that its majority-owned unit Japan Advanced Semiconductor Manufacturing in Kumamoto would build a second fabrication plant, bringing total investment in its Japan venture to more than $20 billion with the support of the Tokyo government.

The company is looking at building advanced packaging capacity in Japan, according to a Reuters report in March, citing two sources familiar with the matter.

Samsung Electronics Co Ltd 005930.KS

Samsung said in March last year it will invest around 300 trillion won ($218.49 billion) by 2042 to develop what the government called the world's largest chip-making base, in line with efforts to enhance South Korea's chip industry.

Micron Technology MU.O

Micron said it would invest $603 million over the next few years in its chip packaging facility in China's Xian city.

STMicroelectronics STMPA.PA

STMicroelectronics and Sanan Optoelectronics 600703.SS plan to set up a silicon carbide manufacturing joint venture in Chongqing, China.

Rapidus

Japan's state-backed Rapidus broke ground on its plant in Japan's northern city of Chitose, a manufacturing hub on the nation's northern island of Hokkaido, in September last year.

VDL

Dutch high tech firm VDL will build a new factory to make semiconductor manufacturing components in Vietnam.

Intel

The chipmaker proposed to invest $3.3 billion in a project in Vietnam and asked the country for "cash support" of 15%, but later decided to move the project to Poland, according to an official document.

Intel

The chipmaker plans to complete the construction of its advanced packaging factory in Malaysia, CEO Pat Gelsinger said.